R&D Laboratory

Thermal Shock Chamber


 Test Method Moving Specimens up and down by elevating system
 Temperature  Test  Low Range -55℃ ~ -20℃
Chamber  High Range 60℃ ~ 150℃
(Basket)  Accuracy ±1.0℃ at 100℃
 Uniformity ±2.0℃℃ at 100℃
 Recovery time Within 5min
 Low  Range -70℃ ~ 0℃(Pre-cooling temp.)
Chamber  Accuracy ±2.0℃
 Pull-down time RT → -70℃ within 70min
 High  Range 60℃ ~ 200℃(Pre-heating temp.)
Chamber  Accuracy ±2.0℃
 Heat up time RT → 200℃ within 20min
 Material  Internal Stainless steel 1.5t
 External Steel (SS41, Powder coating)
 Insulation Mineral wool 100t
 Heater Incoloy Pipe heater
  • Based on the standards—IEC and MIL—this equipment significantly changes the temperature through repeated cooling and heating to perform a reliability test or conduct a research for damages in a sample caused by heat deformation (PCB crack, etc.), electronic parts, automobile parts, LCD, etc. According to the method, it is divided into 2-zone and 3-zone.
  • The use environment of industrial materials, parts, and products is different in accordance with the regional or seasonal change. Thus, complete reliability following the temperature change is needed. A thermal shock tester artificially implements significant temperature change (thermal shock) to evaluate the reliability of each sample.
  • By rapidly changing the temperature setting, this equipment can meet the customers’ requirements. In accordance with the test condition, 2-zone (Up/Down movement: High temperature ↔ Low temperature) can be set.

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